Wiresawing is a method of slicing or cutting through silicon wafers, granite, marble or stone using a steel wire and an abrasive silicon carbide slurry.

In wiresawing—also referred to as wafer slicing—a taut steel wire is run through an abrasive slurry, where the SiC acts as the cutting agent between the workpiece and the wire. Wiresawing is commonly used in the granite- and stone-cutting industry, silicon wafer production, and other crystal-cutting applications.

Washington Mills has been a leading manufacturer of silicon carbide abrasive powder for the wiresawing industry for both solar and semiconductor applications. Silicon carbide for wire sawing can be provided in both green and black and according to ANSI, FEPA or JIS standards. Washington Mills is also able to provide customer distributions, surface chemistry treatments, and particle shape to meet the applications demands.