Semiconductor

Electronics Manufacturing

In electronics manufacturing, our fused minerals find applications in slicing, lapping, backside blasting, polishing and cleaning. Fine abrasive powders are extremely hard materials, and our powders are chemically inert and manufactured to high crystalline purity, making them ideally suited for electronics manufacturing where precision work is required. Through these properties, abrasive powders can be used to clean delicate surfaces during the manufacturing process, removing free contaminates such as transition metals and therefore aiding in the prevention of potential device failure due to contaminated substrate.

Contact our highly experienced technical team for assistance selecting or customizing the proper product and powder size for your specific applications and needs.

Wafer Slicing

Wafer slicing is the act of a taut steel wire running through an abrasive silicon carbide slurry, where the SiC acts as the cutting agent between the workpiece and the wire.

Washington Mills’ group-graded silicon carbide grains and precision-engineered powders are used as a loose abrasive in the cutting of silicon wafers.